"Support for prototype development from one piece" Application of joining and film formation.
Can be used in high-temperature environments, utilizing high-performance materials!
Our company offers "joining and film formation" utilizing high-performance materials. We can perform "hermetic joining using glass paste," as well as "direct brazing without metallization" and "the creation of electrolytic cells layered with powder catalysts or metal pastes." We can accommodate prototype development starting from one piece, so please feel free to contact us when needed. 【Features of Joining】 < Hermetic Joining Using Glass Paste > - Capable of producing integrated parts at 300°C - Low gas leakage, small thermal expansion difference, no need for metallization < Direct Brazing Without Metallization > - Reduction of processes (compared to metallization methods), high joint strength, capable of handling irregular shapes and small quantities < Pressurized Joining (Solder Paste, Polyimide Film) > - Can be joined at lower temperatures (e.g., 300°C) than brazing, suitable for small lots and short delivery times *For more details, please refer to the PDF document or feel free to contact us.
- Company：石原ケミカル 高機能材料
- Price：Other
